My tips here apply to hobby/prototyping and not to production work, and not to surface mount.
I usually switch the iron to high power setting ( eg 30W) before doing a joint, even for ic pins.
That is because a quick application of a hot iron will do a better joint and have less heat running down to the component that a slow joint with a cold iron.
Always examine the new joints with a magnifier, looking for fusion to the pin and no runs over to another pad.
A few minutes here can save big dramas and time wasting at power up time.
When replacing an ic, or header etc, first cut all the pins off with the nippers, then re-tin the pads, then just suck the remaining pin out of the pad.
Use IC sockets where possible.
For development or hobby work I do not wrap the wire around the terminal ( contrary to production procedure). Just make J hooks and fuse around the terminal.
This allows more reliable de/resoldering with less insulation damage if a change is to be made.
Do not strip mod wire or enamelled copper wire. Instead, use the iron tip aganst a paper pad to melt off the insulation. This is to avoid nicks in the copper wire which can break at edge of the joint.
When the iron is sitting in its holder set it to low ( eg 15 W ) to preserve tip life.
To get the tip hottest for a bigger joint, hold the iron vertically so the hot air shrouds the tip, before doing the joint.
Before desoldering using a solder wick or solder sucker, always remelt the joint first with a soldering iron and apply some new solder (mainly for the flux).
When the tip gets eroded, I file it back to a new tip with a flat then re-tin.
I have a life time supply of the old 60/40 resin core, but for my son's projects I use lead free. It seems to work just as well.
Oh.. and my soldering improved greatly after the new lens implants !